Union Series
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Spring-fixed tray
Union Clamp Tray (with Spring & Clamp Function)Super tray that will resolve problems and improve manufacturing factories
■ Compatible with your product shape and process
■ Highly-precise special spring that enables batch product fixing and releasing
■ No need to change a tray when transferring to the following process (vacuum filming, printing, inspection, assembly)
■ Reversible within process
■ Customized design to improve production efficiency
■ All-in support from design to commercialization based on the required specifications
■ Laser marking / Welding & Laser printing / Die bonding / Vapor deposition / etc.
Customizable depending on different products' shape and process -
World's thinnest “0.05mm” Contact Sheet
Union High Speed Sheet “UHSS”Totally new, innovative contact sheet that overturn the testing of semiconductor at any phase for wafer, package, and system levels, and trial and mass production.
[High current]
Highest-ever current allowance (3A) than other conventional type (*)
[High-speed transfer]
High frequency (200 Gbps) with thinness (t = 0.05 mm) and super-short transfer route
[Fine pitch]
0.08 mm at minimum
[Stable contact]
Multi-point contact structure that is compatible with complicated operating environments
[High durability]
Durable to 50,000 cycles at the mass production level (*)
[Application]
Can be used for different areas and applications and compatible withHigh-density mounting
Interposer / Contact for semiconductors and electronic parts sockets / circuit boards, etc.
(*) Based on our testing
